New technology has created a demand for more proficient electropolishing.
Methods used in the past no longer meet the criteria set by manufacturers of
semi-conductor, vacuum systems medical devices, food-processing equipment and others
concerned with high purity. Electromatic has co-operated with many component manufacturers
to achieve results leading to qualification and acceptance of their products for UHP
applications.
Large Scale Integration
The development of ultra-clean gas delivery systems is critically
important to the advancement of submicron LST fabrication technologies. Electromatic is in
the forefront in process research in surface cleaning and chromium enrichment of tubing
and other components used in these systems.
Cleanliness: The component must meet three general
characteristics: particle-free, outgas-free, and with trace-element cross-contamination
below certain levels. In order to improve yields on submicron-level chip manufacturing, a
strong emphasis has been placed in eliminating Na+, Cl -, PO4- - -, SO4- -, chemical
species that may cause catastrophic failure of a device if it finds its way into the final
etching of the circuit. At Electromatic we have developed methods to deal with such
cross-contamination and can reliably process components to meet the criteria set by INTEL:
|
Sulphur |
<1% |
|
Phosphorus |
<2% |
|
Sodium |
Not detectable |
|
Chlorine |
Not detectable |
During manufacture, certain operations may contribute to material degradation leading
to eventual failure. To avoid such defects, Electromatic works closely with customersÕ
engineers in providing innovative methods for surface treatment.
To prevent contamination during the electropolishing, Electromatic
observes strict quality standards. These include use of hot and cold D.I. water
rinses, with water quality monitored at 18 megohms @ 25°C. filtered to 0.02 microns. The
final rinse is followed by a total dry nitrogen blow-down from a cryogenic source 99.999%
pure.
Surface Integrity: Smoothness of the metal surface,
usually in the range of 4 10 Ra, and absence of defects are important factors.
Pitting, haze, gas marks, etching, cracks and scratches are causes for rejection, as these
are sites where corrosion originates. By the use of custom-engineered racking systems, and
correct electropolishing techniques, such defects can be prevented, with the exception of
those caused by material imperfections, or irreparable damage from prior manufacturing
processes. At Electromatic, parts are subjected to incoming, in-process, and outgoing
inspection, and carefully evaluated as to acceptability.
Chromium Enrichment: Perhaps the most significant
requisite is the generation of chromium at the surface of the metal. The causes for the
changes in chemical composition are complex, but the results are quantifiable. Measurement
of the ratios and depths of the resultant chromium-oxide layer provides a good test of the
quality of the electropolishing. The generally accepted UHP values for 316L stainless
steel, in accordance with SEMATEC standards, are as follows:
|
Oxide thickness |
25 50 Angstrom |
|
Cr/Fe ratio |
1.5 or greater, usually found at one-half the oxide thickness |
|
CrO/FeO ratio |
2.00 or greater |
|
Depth of enrichment |
18 - 23 Angstrom |
To reach optimum values on a particular component may take experimentation and require
analyses of several replicates. However, once the electropolishing parameters have been
established, Electromatic can assure that such values will be reproduced.
Surface Analysis: The recognized methods for the
measurement of surfaces include electron spectroscopy for chemical analysis (ESCA), Auger
electron spectroscopy (AES) and scanning electron microscopy (SEM). Electromatic has
undertaken extensive testing and analyses of the results using all of these methods.
Samples taken from production runs are submitted on a regular basis to an independent
testing laboratory to assure qualification. Some of these reports are reproduced below and
demonstrate how Electromatic meets and even exceeds industry standards.
Chromium to
iron ratios as determined by ESCA high-resolution data. |
Sample
ID |
Reduced
Chromium |
Reduced
Iron |
Chromium
Oxide |
Iron
Oxide |
Total
Cr / Fe |
Cr Oxide /
Fe Oxide |
Sample 3149 |
8.2 |
54. |
18.4 |
19.8 |
1.6 |
2.7 |
SSL-1029-0996
Measurements from AES depth
profile data.
All depth and thickness values are expressed in Ta2O5 equivalents. |
Sample
ID |
Oxide
Thickness (Å) |
Max Cr/Fe
Ratio
(depth, Å) |
Depth of
Enrichment
(Å) |
Surface Iron
Oxide
Thickness
(Å) |
Cr Enrichment
Layer
Thickness
(Å) |
Carbon Layer
Thickness
(Å) |
Sample 3149 |
39 |
1.5 (19) |
29 |
9 |
20 |
0 |
SSL-1029-0996
Other UHP Applications
From the in-depth experience gained in LSI component processing,
Electromatic can assist manufacturers in other high-tech industries achieve outstanding
results.
Vacuum: In the manufacture of high vacuum chambers
used for vacuum deposition, our processes are capable of providing surfaces that have a
very low outgassing profile. This enables the final system to pump down to 10-7 Torr three
to five times faster than if the surface were not treated.
Medical: Electropolishing
is widely used for the equipment and surgical tools used in the medical and dental
professions. The Electromatic UHP Process particularly applies to bodily invasive
devices such as ear, dental, joint and bone implants, where super-clean, inert,
unpitted surfaces are a necessity.
Pre-Coating: When parts require special coating, the UHP
Process provides a means for microsizing to close tolerances, and at the same time
producing a surface free of contaminants that inhibit adhesion. Electromatic has used this
technique effectively as a pre-treatment for polymer coatings that must guarantee a
25-year life to components in the propulsion and cooling systems of the Freedom Space
Station.